HMK107B7223MA-T [TAIYO YUDEN]
Ceramic Capacitor, Multilayer, Ceramic, 100V, 20% +Tol, 20% -Tol, X7R, 15% TC, 0.022uF, Surface Mount, 0603, CHIP, LEAD FREE;
| 型号： | HMK107B7223MA-T |
| 厂家： | 
TAIYO YUDEN (U.S.A.), INC |
| 描述： | Ceramic Capacitor, Multilayer, Ceramic, 100V, 20% +Tol, 20% -Tol, X7R, 15% TC, 0.022uF, Surface Mount, 0603, CHIP, LEAD FREE 电容器 |
| 文件： | 总20页 (文件大小：1494K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Notice for TAIYO YUDEN productsꢀ
Please read this notice before using the TAIYO YUDEN products.
REMINDERS
■ Product information in this catalog is as of October 2012. All of the contents specified herein are subject to change
without notice due to technical improvements, etc. Therefore, please check for the latest information carefully be-
fore practical application or usage of the Products.
Please note that Taiyo Yuden Co., Ltd. shall not be responsible for any defects in products or equipment incorpo-
rating such products, which are caused under the conditions other than those specified in this catalog or individual
specification.
■ Please contact Taiyo Yuden Co., Ltd. for further details of product specifications as the individual specification is
available.
■ Please conduct validation and verification of products in actual condition of mounting and operating environment
before commercial shipment of the equipment.
■ All electronic components or functional modules listed in this catalog are developed, designed and intended for
use in general electronics equipment.(for AV, office automation, household, office supply, information service,
telecommunications, (such as mobile phone or PC) etc.). Before incorporating the components or devices into any
equipment in the field such as transportation,( automotive control, train control, ship control), transportation signal,
disaster prevention, medical, public information network (telephone exchange, base station) etc. which may have
direct influence to harm or injure a human body, please contact Taiyo Yuden Co., Ltd. for more detail in advance.
Do not incorporate the products into any equipment in fields such as aerospace, aviation, nuclear control, subma-
rine system, military, etc. where higher safety and reliability are especially required.
In addition, even electronic components or functional modules that are used for the general electronic equipment,
if the equipment or the electric circuit require high safety or reliability function or performances, a sufficient reliabil-
ity evaluation check for safety shall be performed before commercial shipment and moreover, due consideration to
install a protective circuit is strongly recommended at customer's design stage.
■ The contents of this catalog are applicable to the products which are purchased from our sales offices or distribu-
tors (so called“TAIYO YUDEN’s official sales channel”).
It is only applicable to the products purchased from any of TAIYO YUDEN’s official sales channel.
■ Please note that Taiyo Yuden Co., Ltd. shall have no responsibility for any controversies or disputes that may oc-
cur in connection with a third party's intellectual property rights and other related rights arising from your usage of
products in this catalog. Taiyo Yuden Co., Ltd. grants no license for such rights.
■ Caution for export
Certain items in this catalog may require specific procedures for export according to“Foreign Exchange and For-
eign Trade Control Law”of Japan,“U.S. Export Administration Regulations”, and other applicable regulations.
Should you have any question or inquiry on this matter, please contact our sales staff.
MULTILAYER CERAMIC CAPACITORS
WAVE
REFLOW
■PARTS NUMBER
△＝Blank space
J
M
K
3
1
6
△
⑤
B
J
1
0
6
M
L
－
⑩
T
△
⑫
①
②
③
④
⑥
⑦
⑧
⑨
⑪
①Rated voltage
③End termination
Code
P
Rated voltage［VDC］
Code
K
End termination
2.5
4
Plated
A
R
High Reliability Application
J
6.3
10
④Dimension（L×W）
Type
L
Dimensions
E
16
EIA（inch）
（L×W）［mm］
0.4×0.2
T
25
042
063
01005
0201
0402
0204
0603
0306
0805
0508
1206
1210
1812
G
U
35
0.6×0.3
50
1.0×0.5
H
100
250
630
105
107
212
0.52×1.0 ※
1.6×0.8
Q
S
0.8×1.6 ※
2.0×1.25
1.25×2.0 ※
3.2×1.6
②Series name
Code
M
Series name
316
325
432
Multilayer ceramic capacitor
3.2×2.5
V
Multilayer ceramic capacitor for high frequency
LW reverse type multilayer capacitor
4.5×3.2
W
Note : ※LW reverse type（□WK） only
⑤Dimension tolerance
Code
△
Type
ALL
063
L［mm］
W［mm］
T［mm］
Standard
Standard
Standard
0.6±0.05
1.0±0.10
0.3±0.05
0.3±0.05
0.5±0.10
105
0.5±0.10
107
1.6＋0.15/－0.05
0.8＋0.15/－0.05
0.8＋0.15/－0.05
0.45±0.05
A
212
2.0＋0.15/－0.05
1.25＋0.15/－0.05
1.25±0.20
0.85±0.10
1.25＋0.15/－0.05
0.85±0.10
316
3.2±0.20
1.6±0.20
325
105
3.2±0.30
2.5±0.30
2.5±0.30
1.0＋0.15/－0.05
0.5＋0.15/－0.05
0.5＋0.15/－0.05
0.45±0.05
107
212
1.6＋0.20/－0
2.0＋0.20/－0
0.8＋0.20/－0
1.25＋0.20/－0
0.8＋0.20/－0
0.85±0.10
B
C
1.25＋0.20/－0
1.6±0.30
316
105
3.2±0.30
1.6±0.30
1.0＋0.20/－0
0.5＋0.20/－0
0.5＋0.20/－0
Note: P.6 Standard external dimensions
△= Blank space
⑥Temperature characteristics code
■High dielectric type（Excluding Super low distortion multilayer ceramic capacitor（CFCAPTM））
Applicable
standard
Temperature
range［℃］
Capacitance
tolerance
±10％
Tolerance
Code
Ref. Temp.［℃］
Capacitance change
±10％
code
K
JIS
B
－25～＋ 85
－55～＋ 85
－55～＋125
－55～＋105
－55～＋125
－55～＋ 85
20
25
25
25
25
25
±20％
M
BJ
±10％
K
EIA
EIA
EIA
EIA
EIA
X5R
X7R
X6S
X7S
X5R
±15％
±20％
M
±10％
K
B7
C6
±15％
±20％
M
±10％
K
±22％
±20％
M
±10％
K
C7
±22％
±20％
M
±10％
K
LD(※)
△F
±15％
±20％
M
JIS
EIA
F
－25～＋ 85
－30～＋ 85
20
25
＋30/－80％
＋22－82％
＋80/－20％
＋80/－20％
Z
Z
Y5V
Note : ※.LD Low distortion high value multilayer ceramic capacitor
△= Blank space
▶ꢀThisꢀcatalogꢀcontainsꢀtheꢀtypicalꢀspecificationꢀonlyꢀdueꢀtoꢀtheꢀlimitationꢀofꢀspace.ꢀꢀWhenꢀyouꢀconsiderꢀtheꢀpurchaseꢀofꢀourꢀproducts,ꢀpleaseꢀcheckꢀourꢀspecification.ꢀ
Forꢀdetailsꢀofꢀeachꢀproductꢀ(characteristicsꢀgraph,ꢀreliabilityꢀinformation,ꢀprecautionsꢀforꢀuse,ꢀandꢀsoꢀon),ꢀseeꢀourꢀWebꢀsiteꢀ(http://www.ty-top.com/)ꢀ.ꢀ
ꢀ
4
■Temperature compensating type
Applicable
Temperature
range［℃］
Capacitance
tolerance
±0.1pF
±0.25pF
±0.5pF
1pF
Tolerance
Code
Ref. Temp.［℃］
20
Capacitance change
0±60ppm/℃
standard
code
B
JIS
EIA
CH
C
D
CH
－55～＋125
F
C0H
25
±5％
J
±10％
K
JIS
EIA
JIS
EIA
JIS
CJ
C0J
CK
20
25
20
25
20
CJ
CK
－55～＋125
－55～＋125
0±120ppm/℃
0±250ppm/℃
±0.25pF
±0.25pF
C
C
C0J
UJ
±0.25pF
±0.5pF
±5％
C
D
J
UJ
－55～＋125
－750±120ppm/℃
EIA
U2J
25
JIS
EIA
JIS
UK
U2K
S
－55～＋125
－55～＋125
－55～＋125
20
25
20
UK
SL
－750±250ppm/℃
±0.5pF
±5％
C
J
+350～－1000ppm/℃
⑥Series code
（Super low distortion multilayer ceramic capacitor（CFCAPTM）only）
⑨Thickness
Code
C
Thickness［mm］
0.2
Code
SD
Series code
Standard
D
P
T
K
V
W
A
D
F
0.2(Temperature compensating of 042type)
0.3
0.45
0.5
⑦Nominal capacitance
Code
Nominal capacitance
（example）
0R5
0.5pF
1pF
010
0.8
100
10pF
0.85(212type or more)
101
100p
1.15
1.25
1.6
102
1,000pF
10,000pF
0.1μF
1.0μF
10μF
100μF
G
L
103
104
N
Y
M
1.9
105
2.0 max
2.5
106
107
Note : R＝Decimal point
⑩Special code
Code
－
Special code
Standard
⑧Capacitance tolerance
Code
B
Capacitance tolerance
±0.1pF
⑪Packaging
C
±0.25pF
±0.5pF
Code
Packaging
D
F
T
φ178mm Taping （2mm pitch）
F
±1pF
φ178mm Taping （4mm pitch）
J
±5％
φ178mm Taping （4mm pitch, 1000 pcs/reel）
325 type（Thickness code M）
P
K
±10％
M
Z
±20％
W
φ178mm Taping（1mm pitch）042type only
＋80/－20％
⑫Internal code
Code
△
Internal code
Standard
▶ꢀThisꢀcatalogꢀcontainsꢀtheꢀtypicalꢀspecificationꢀonlyꢀdueꢀtoꢀtheꢀlimitationꢀofꢀspace.ꢀꢀWhenꢀyouꢀconsiderꢀtheꢀpurchaseꢀofꢀourꢀproducts,ꢀpleaseꢀcheckꢀourꢀspecification.ꢀ
Forꢀdetailsꢀofꢀeachꢀproductꢀ(characteristicsꢀgraph,ꢀreliabilityꢀinformation,ꢀprecautionsꢀforꢀuse,ꢀandꢀsoꢀon),ꢀseeꢀourꢀWebꢀsiteꢀ(http://www.ty-top.com/)ꢀ.ꢀ
ꢀ
5
■STANDARD EXTERNAL DIMENSIONS
Dimension [mm]
T
Type( EIA )
□MK042（01005）
□MK063（0201）
Ｌ
Ｗ
*1
C
D
P
T
e
0.4±0.02
0.2±0.02
0.2±0.02
0.3±0.03
0.1±0.03
0.6±0.03
1.0±0.05
0.3±0.03
0.5±0.05
0.15±0.05
0.25±0.10
0.2±0.02
0.3±0.03
0.5±0.05
0.5±0.05
0.3±0.05
0.45±0.05
0.8±0.10
0.8±0.10
0.5±0.05
0.45±0.05
0.85±0.10
1.25±0.10
1.25±0.10
0.85±0.1
0.85±0.10
1.15±0.10
1.25±0.10
1.6±0.20
1.6±0.20
0.85±0.10
1.15±0.10
1.9±0.20
1.9+0.1/-0.2
2.5±0.20
1.9±0.20
2.5±0.20
2.5±0.20
C
P
V
W
P
K
□MK105（0402）
□VK105（0402）
1.0±0.05
0.5±0.05
1.0±0.05
0.25±0.10
0.18±0.08
□WK105（0204）※
0.52±0.05
□MK107（0603）
1.6±0.10
0.8±0.10
0.35±0.25
A
Ａ
Ｖ
K
□MR107（0603）
1.6±0.10
0.8±0.10
0.8±0.10
1.6±0.10
0.1～0.6
□WK107（0306）※
0.25±0.15
e
□MK212（0805）
2.0±0.10
1.25±0.10
D
G
Ｇ
Ｄ
D
Ｆ
G
L
0.5±0.25
※ LW reverse type
□MR212（0805）
2.0±0.10
1.25±0.10
2.0±0.15
0.25～0.75
0.3±0.2
□WK212（0508）※
1.25±0.15
□MK316（1206）
□MR316（1206）
3.2±0.15
3.2±0.15
1.6±0.15
1.6±0.15
0.5+0.35/-0.25
0.25～0.85
Ｌ
D
F
□MK325（1210）
3.2±0.30
2.5±0.20
N
Y
0.6±0.3
M
N
M
M
□MR325（1210）
□MK432（1812）
3.2±0.30
4.5±0.40
2.5±0.20
3.2±0.30
0.3～0.9
0.9±0.6
Note : ※. LW reverse type, *1.Thickness code
■STANDARD QUANTITY
Dimension
Standard quantity［pcs］
Type
042
EIA（inch）
01005
［ｍｍ］
0.2
Code
C
D
P
Paper tape
Embossed tape
－
40000
063
0201
0402
0.3
15000
－
T
0.2
0.3
C
P
20000
15000
－
－
105
V
W
P
0.5
10000
－
0204 ※
0603
0.30
0.45
0.8
K
4000
－
－
4000
－
107
212
A
V
K
0306 ※
0.50
0.45
0.85
1.25
0.85
0.85
1.15
1.25
1.6
4000
0805
D
G
D
D
F
－
3000
－
0508 ※
4000
4000
－
316
1206
－
－
3000
2000
G
L
0.85
1.15
1.9
D
F
－
2000
325
432
1210
1812
N
Y
2.0 max
2.5
M
M
－
－
500（T），1000（P）
500
2.5
Note : ※.LW Reverse type（□WK）
▶ꢀThisꢀcatalogꢀcontainsꢀtheꢀtypicalꢀspecificationꢀonlyꢀdueꢀtoꢀtheꢀlimitationꢀofꢀspace.ꢀꢀWhenꢀyouꢀconsiderꢀtheꢀpurchaseꢀofꢀourꢀproducts,ꢀpleaseꢀcheckꢀourꢀspecification.ꢀ
Forꢀdetailsꢀofꢀeachꢀproductꢀ(characteristicsꢀgraph,ꢀreliabilityꢀinformation,ꢀprecautionsꢀforꢀuse,ꢀandꢀsoꢀon),ꢀseeꢀourꢀWebꢀsiteꢀ(http://www.ty-top.com/)ꢀ.ꢀ
ꢀ
6
■PARTS NUMBER
【Temperature Characteristic SD : Standard】ꢀ0.85mm thickness（D）
Soldering
R:Reflow
W:Wave
Thickness*3
[mm]
HALT
Temperature
characteristics
Capacitance
[F]
Capacitance
tolerance [％]
tanδ
[％]
Part number 1
Part number 2
Rated voltage [V]
Rated voltage x ％
UMK212 SD392KD-T
UMK212 SD472KD-T
UMK212 SD562KD-T
UMK212 SD682KD-T
UMK212 SD822KD-T
UMK212 SD103KD-T
GMK212 SD123KD-T
GMK212 SD153KD-T
EMK212 SD333KD-T
LMK212 SD473KD-T
3900 p
4700 p
±10
±10
±10
±10
±10
±10
±10
±10
±10
±10
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
200
200
200
200
200
200
200
200
200
200
0.85±0.10
0.85±0.10
0.85±0.10
0.85±0.10
0.85±0.10
0.85±0.10
0.85±0.10
0.85±0.10
0.85±0.10
0.85±0.10
R
R
R
R
R
R
R
R
R
R
5600 p
50
35
6800 p
8200 p
Standard Type
10000 p
12000 p
15000 p
33000 p
47000 p
16
10
●316TYPE
【Temperature Characteristic SD : Standard】ꢀ1.6mm thickness（L）
Soldering
R:Reflow
W:Wave
R
Thickness*3
[mm]
HALT
Temperature
characteristics
Capacitance
[F]
Capacitance
tolerance [％]
tanδ
[％]
Part number 1
Part number 2
Rated voltage [V]
25
Rated voltage x ％
TMK316 SD823KL-T
TMK316 SD104KL-T
82000 p
0.1 μ
±10
±10
0.1
0.1
200
200
1.6±0.20
1.6±0.20
Standard Type
R
【Temperature Characteristic SD : Standard】ꢀ1.15mm thickness（F）
Soldering
R:Reflow
W:Wave
Thickness*3
[mm]
HALT
Temperature
characteristics
Capacitance
[F]
Capacitance
tolerance [％]
tanδ
[％]
Part number 1
Part number 2
Rated voltage [V]
35
Rated voltage x ％
GMK316 SD333KF-T
GMK316 SD393KF-T
TMK316 SD473KF-T
TMK316 SD563KF-T
TMK316 SD683KF-T
33000 p
39000 p
47000 p
56000 p
68000 p
±10
±10
±10
±10
±10
0.1
0.1
0.1
0.1
0.1
200
200
200
200
200
1.15±0.10
1.15±0.10
1.15±0.10
1.15±0.10
1.15±0.10
R
R
R
R
R
Standard Type
25
Low Distortion High Value Multilayer Ceramic Capacitors�CFꢁLDꢂ
●107TYPE
【Temperature Characteristic LD : X5R】ꢀ0.8mm thickness（A）
Soldering
R:Reflow
W:Wave
R
Thickness*3
[mm]
HALT
Temperature
characteristics
Capacitance
[F]
Capacitance
tolerance [％]
tanδ
[％]
Part number 1
Part number 2
Rated voltage [V]
25
Rated voltage x ％
150
TMK107BLD105[]A-T
X5R
1 μ
±10，±20
10
0.8+0.20/-0
●212TYPE
【Temperature Characteristic LD : X5R】ꢀ1.25mm thickness（G）
Soldering
R:Reflow
W:Wave
R
Thickness*3
[mm]
HALT
Temperature
characteristics
Capacitance
[F]
Capacitance
tolerance [％]
tanδ
[％]
Part number 1
Part number 2
Rated voltage [V]
35
Rated voltage x ％
GMK212 LD105[]G-T
GMK212BLD225[]G-T
X5R
X5R
1 μ
±10，±20
±10，±20
10
10
150
150
1.25±0.10
2.2 μ
1.25+0.20/-0
R
●316TYPE
【Temperature Characteristic LD : X5R】ꢀ1.6mm thickness（L）
Soldering
R:Reflow
W:Wave
Thickness*3
[mm]
Rated voltage [V]
HALT
Temperature
characteristics
Capacitance
[F]
Capacitance
tolerance [％]
tanδ
[％]
Part number 1
Part number 2
Rated voltage x ％
UMK316 LD105[]L-T
GMK316BLD475[]L-T
TMK316BLD106[]L-T
50
35
25
X5R
X5R
X5R
1 μ
4.7 μ
10 μ
±10，±20
±10，±20
±10，±20
10
10
10
150
150
150
1.6±0.20
1.6±0.30
1.6±0.30
R
R
R
●325TYPE
【Temperature Characteristic LD : X5R】ꢀ1.9mm thickness（N）
Soldering
R:Reflow
W:Wave
R
Thickness*3
[mm]
HALT
Temperature
characteristics
Capacitance
[F]
Capacitance
tolerance [％]
tanδ
[％]
Part number 1
Part number 2
Rated voltage [V]
50
Rated voltage x ％
200
UMK325 LD105[]N-T
X5R
1 μ
±10，±20
10
1.9±0.20
Medium-High Voltage Multilayer Ceramic Capacitor
●107TYPE
【Temperature Characteristic BJ : B/X5R】ꢀ0.8mm thickness（A）
Soldering
R:Reflow
W:Wave
Thickness*3
[mm]
HALT
Temperature
characteristics
Capacitance
[F]
Capacitance
tolerance [％]
tanδ
[％]
Part number 1
Part number 2
Rated voltage [V]
Rated voltage x ％
X5R*1
B
HMK107 BJ102[]A-T
HMK107 BJ152[]A-T
HMK107 BJ222[]A-T
HMK107 BJ332[]A-T
HMK107 BJ472[]A-T
HMK107 BJ682[]A-T
HMK107 BJ103[]A-T
HMK107 BJ153[]A-T
HMK107 BJ223[]A-T
HMK107 BJ333[]A-T
HMK107 BJ104[]A-T
1000 p
1500 p
2200 p
3300 p
4700 p
6800 p
10000 p
15000 p
22000 p
33000 p
0.1 μ
±10，±20
±10，±20
±10，±20
±10，±20
±10，±20
±10，±20
±10，±20
±10，±20
±10，±20
±10，±20
±10，±20
3.5
3.5
3.5
3.5
3.5
3.5
3.5
3.5
3.5
3.5
3.5
200
200
200
200
200
200
200
200
200
200
200
0.8±0.10
0.8±0.10
0.8±0.10
0.8±0.10
0.8±0.10
0.8±0.10
0.8±0.10
0.8±0.10
0.8±0.10
0.8±0.10
0.8±0.10
R
R
R
R
R
R
R
R
R
R
R
X5R*1
B
X5R*1
B
X5R*1
B
X5R*1
B
X5R*1
B
100
X5R*1
B
X5R*1
B
X5R*1
B
X5R*1
B
X5R*1
B
▶ꢀThisꢀcatalogꢀcontainsꢀtheꢀtypicalꢀspecificationꢀonlyꢀdueꢀtoꢀtheꢀlimitationꢀofꢀspace.ꢀꢀWhenꢀyouꢀconsiderꢀtheꢀpurchaseꢀofꢀourꢀproducts,ꢀpleaseꢀcheckꢀourꢀspecification.ꢀ
Forꢀdetailsꢀofꢀeachꢀproductꢀ(characteristicsꢀgraph,ꢀreliabilityꢀinformation,ꢀprecautionsꢀforꢀuse,ꢀandꢀsoꢀon),ꢀseeꢀourꢀWebꢀsiteꢀ(http://www.ty-top.com/)ꢀ.ꢀ
ꢀ
21
■PARTS NUMBER
【Temperature Characteristic B7 : X7R , C7 : X7S】ꢀ0.8mm thickness（A）
Soldering
R:Reflow
W:Wave
Thickness*3
[mm]
HALT
Temperature
characteristics
Capacitance
[F]
Capacitance
tolerance [％]
tanδ
[％]
Part number 1
Part number 2
Rated voltage [V]
Rated voltage x ％
HMK107 B7102[]A-T
HMK107 B7152[]A-T
HMK107 B7222[]A-T
HMK107 B7332[]A-T
HMK107 B7472[]A-T
HMK107 B7682[]A-T
HMK107 B7103[]A-T
HMK107 B7153[]A-T
HMK107 B7223[]A-T
HMK107 B7333[]A-T
HMK107 C7104[]A-T
X7R
X7R
X7R
X7R
X7R
X7R
X7R
X7R
X7R
X7R
X7S
1000 p
1500 p
2200 p
3300 p
4700 p
6800 p
10000 p
15000 p
22000 p
33000 p
0.1 μ
±10，±20
±10，±20
±10，±20
±10，±20
±10，±20
±10，±20
±10，±20
±10，±20
±10，±20
±10，±20
±10，±20
3.5
3.5
3.5
3.5
3.5
3.5
3.5
3.5
3.5
3.5
3.5
200
200
200
200
200
200
200
200
200
200
200
0.8±0.10
0.8±0.10
0.8±0.10
0.8±0.10
0.8±0.10
0.8±0.10
0.8±0.10
0.8±0.10
0.8±0.10
0.8±0.10
0.8±0.10
R
R
R
R
R
R
R
R
R
R
R
100
●212TYPE
【Temperature Characteristic BJ : B/X5R】ꢀ1.25mm thickness（G）
Soldering
R:Reflow
W:Wave
Thickness*3
[mm]
HALT
Temperature
characteristics
Capacitance
[F]
Capacitance
tolerance [％]
tanδ
[％]
Part number 1
Part number 2
Rated voltage [V]
Rated voltage x ％
X5R*1
B
HMK212 BJ103[]G-T
HMK212 BJ153[]G-T
HMK212 BJ223[]G-T
HMK212 BJ333[]G-T
HMK212 BJ473[]G-T
HMK212 BJ683[]G-T
HMK212 BJ104[]G-T
HMK212 BJ224[]G-T
QMK212 BJ472[]G-T
QMK212 BJ682[]G-T
QMK212 BJ103[]G-T
QMK212 BJ153[]G-T
QMK212 BJ223[]G-T
10000 p
15000 p
22000 p
33000 p
47000 p
68000 p
0.1 μ
±10，±20
±10，±20
±10，±20
±10，±20
±10，±20
±10，±20
±10，±20
±10，±20
±10，±20
±10，±20
±10，±20
±10，±20
±10，±20
3.5
3.5
3.5
3.5
3.5
3.5
3.5
3.5
2.5
2.5
2.5
2.5
2.5
200
200
200
200
200
200
200
200
150
150
150
150
150
1.25±0.10
1.25±0.10
1.25±0.10
1.25±0.10
1.25±0.10
1.25±0.10
1.25±0.10
1.25±0.10
1.25±0.10
1.25±0.10
1.25±0.10
1.25±0.10
1.25±0.10
R
R
R
R
R
R
R
R
R
R
R
R
R
X5R*1
B
X5R*1
B
X5R*1
B
100
X5R*1
B
X5R*1
B
X5R*1
B
X5R*1
B
0.22 μ
4700 p
X5R*1
B
X5R*1
B
6800 p
X5R*1
B
250
10000 p
15000 p
22000 p
X5R*1
B
X5R*1
B
【Temperature Characteristic BJ : B/X5R】ꢀ0.85mm thickness（D）
Soldering
R:Reflow
W:Wave
R
R
R
R
Thickness*3
[mm]
HALT
Temperature
characteristics
Capacitance
[F]
Capacitance
tolerance [％]
tanδ
[％]
Part number 1
Part number 2
Rated voltage [V]
Rated voltage x ％
X5R*1
B
QMK212 BJ102[]D-T
QMK212 BJ152[]D-T
QMK212 BJ222[]D-T
QMK212 BJ332[]D-T
1000 p
1500 p
2200 p
3300 p
±10，±20
±10，±20
±10，±20
±10，±20
2.5
2.5
2.5
2.5
150
150
150
150
0.85±0.10
0.85±0.10
0.85±0.10
0.85±0.10
X5R*1
B
250
X5R*1
B
X5R*1
B
【Temperature Characteristic B7 : X7R】ꢀ1.25mm thickness（G）
Soldering
R:Reflow
W:Wave
Thickness*3
[mm]
HALT
Temperature
characteristics
Capacitance
[F]
Capacitance
tolerance [％]
tanδ
[％]
Part number 1
Part number 2
Rated voltage [V]
Rated voltage x ％
HMK212 B7103[]G-T
HMK212 B7153[]G-T
HMK212 B7223[]G-T
HMK212 B7333[]G-T
HMK212 B7473[]G-T
HMK212 B7683[]G-T
HMK212 B7104[]G-T
HMK212 B7224[]G-T
QMK212 B7472[]G-T
QMK212 B7682[]G-T
QMK212 B7103[]G-T
QMK212 B7153[]G-T
QMK212 B7223[]G-T
X7R
X7R
X7R
X7R
X7R
X7R
X7R
X7R
X7R
X7R
X7R
X7R
X7R
10000 p
15000 p
22000 p
33000 p
47000 p
68000 p
0.1 μ
±10，±20
±10，±20
±10，±20
±10，±20
±10，±20
±10，±20
±10，±20
±10，±20
±10，±20
±10，±20
±10，±20
±10，±20
±10，±20
3.5
3.5
3.5
3.5
3.5
3.5
3.5
3.5
2.5
2.5
2.5
2.5
2.5
200
200
200
200
200
200
200
200
150
150
150
150
150
1.25±0.10
1.25±0.10
1.25±0.10
1.25±0.10
1.25±0.10
1.25±0.10
1.25±0.10
1.25±0.10
1.25±0.10
1.25±0.10
1.25±0.10
1.25±0.10
1.25±0.10
R
R
R
R
R
R
R
R
R
R
R
R
R
100
0.22 μ
4700 p
6800 p
250
10000 p
15000 p
22000 p
【Temperature Characteristic B7 : X7R】ꢀ0.85mm thickness（D）
Soldering
R:Reflow
W:Wave
Thickness*3
[mm]
HALT
Temperature
characteristics
Capacitance
[F]
Capacitance
tolerance [％]
tanδ
[％]
Part number 1
Part number 2
Rated voltage [V]
Rated voltage x ％
QMK212 B7102[]D-T
QMK212 B7152[]D-T
QMK212 B7222[]D-T
QMK212 B7332[]D-T
X7R
X7R
X7R
X7R
1000 p
1500 p
2200 p
3300 p
±10，±20
±10，±20
±10，±20
±10，±20
2.5
2.5
2.5
2.5
150
150
150
150
0.85±0.10
0.85±0.10
0.85±0.10
0.85±0.10
R
R
R
R
250
●316TYPE
【Temperature Characteristic BJ : B/X5R】ꢀ1.6mm thickness（L）
Soldering
R:Reflow
W:Wave
Thickness*3
[mm]
HALT
Temperature
characteristics
Capacitance
[F]
Capacitance
tolerance [％]
tanδ
[％]
Part number 1
Part number 2
Rated voltage [V]
Rated voltage x ％
X5R*1
B
HMK316 BJ473[]L-T
HMK316 BJ683[]L-T
HMK316 BJ104[]L-T
HMK316 BJ154[]L-T
HMK316 BJ224[]L-T
HMK316 BJ334[]L-T
HMK316 BJ474[]L-T
HMK316 BJ105[]L-T
QMK316 BJ333[]L-T
QMK316 BJ473[]L-T
QMK316 BJ683[]L-T
QMK316 BJ104[]L-T
SMK316 BJ153[]L-T
SMK316 BJ223[]L-T
47000 p
68000 p
0.1 μ
±10，±20
±10，±20
±10，±20
±10，±20
±10，±20
±10，±20
±10，±20
±10，±20
±10，±20
±10，±20
±10，±20
±10，±20
±10，±20
±10，±20
3.5
3.5
3.5
3.5
3.5
3.5
3.5
3.5
2.5
2.5
2.5
2.5
2.5
2.5
200
200
200
200
200
200
200
200
150
150
150
150
120
120
1.6±0.20
1.6±0.20
1.6±0.20
1.6±0.20
1.6±0.20
1.6±0.20
1.6±0.20
1.6±0.20
1.6±0.20
1.6±0.20
1.6±0.20
1.6±0.20
1.6±0.20
1.6±0.20
R
R
R
R
R
R
R
R
R
R
R
R
R
R
X5R*1
B
X5R*1
B
X5R*1
B
0.15 μ
0.22 μ
0.33 μ
0.47 μ
1 μ
100
X5R*1
B
X5R*1
B
X5R*1
B
X5R*1
B
X5R*1
B
33000 p
47000 p
68000 p
0.1 μ
X5R*1
B
250
630
X5R*1
B
X5R*1
B
X5R*1
B
15000 p
22000 p
X5R*1
B
▶ꢀThisꢀcatalogꢀcontainsꢀtheꢀtypicalꢀspecificationꢀonlyꢀdueꢀtoꢀtheꢀlimitationꢀofꢀspace.ꢀꢀWhenꢀyouꢀconsiderꢀtheꢀpurchaseꢀofꢀourꢀproducts,ꢀpleaseꢀcheckꢀourꢀspecification.ꢀ
Forꢀdetailsꢀofꢀeachꢀproductꢀ(characteristicsꢀgraph,ꢀreliabilityꢀinformation,ꢀprecautionsꢀforꢀuse,ꢀandꢀsoꢀon),ꢀseeꢀourꢀWebꢀsiteꢀ(http://www.ty-top.com/)ꢀ.ꢀ
ꢀ
22
■PARTS NUMBER
【Temperature Characteristic BJ : B/X5R】ꢀ1.15mm thickness（F）
Soldering
R:Reflow
W:Wave
Thickness*3
[mm]
HALT
Temperature
characteristics
Capacitance
[F]
Capacitance
tolerance [％]
tanδ
[％]
Part number 1
Part number 2
Rated voltage [V]
Rated voltage x ％
X5R*1
B
SMK316 BJ102[]F-T
SMK316 BJ152[]F-T
SMK316 BJ222[]F-T
SMK316 BJ332[]F-T
SMK316 BJ472[]F-T
SMK316 BJ682[]F-T
SMK316 BJ103[]F-T
1000 p
1500 p
2200 p
3300 p
4700 p
6800 p
10000 p
±10，±20
±10，±20
±10，±20
±10，±20
±10，±20
±10，±20
±10，±20
2.5
2.5
2.5
2.5
2.5
2.5
2.5
120
120
120
120
120
120
120
1.15±0.10
1.15±0.10
1.15±0.10
1.15±0.10
1.15±0.10
1.15±0.10
1.15±0.10
R
R
R
R
R
R
R
X5R*1
B
X5R*1
B
X5R*1
B
630
X5R*1
B
X5R*1
B
X5R*1
B
【Temperature Characteristic B7 : X7R】ꢀ1.6mm thickness（L）
Soldering
R:Reflow
W:Wave
Thickness*3
[mm]
HALT
Temperature
characteristics
Capacitance
[F]
Capacitance
tolerance [％]
tanδ
[％]
Part number 1
Part number 2
Rated voltage [V]
Rated voltage x ％
HMK316 B7473[]L-T
HMK316 B7683[]L-T
HMK316 B7104[]L-T
HMK316 B7154[]L-T
HMK316 B7224[]L-T
HMK316 B7334[]L-T
HMK316 B7474[]L-T
HMK316 B7105[]L-T
QMK316 B7333[]L-T
QMK316 B7473[]L-T
QMK316 B7683[]L-T
QMK316 B7104[]L-T
SMK316 B7153[]L-T
SMK316 B7223[]L-T
X7R
X7R
X7R
X7R
X7R
X7R
X7R
X7R
X7R
X7R
X7R
X7R
X7R
X7R
47000 p
68000 p
0.1 μ
±10，±20
±10，±20
±10，±20
±10，±20
±10，±20
±10，±20
±10，±20
±10，±20
±10，±20
±10，±20
±10，±20
±10，±20
±10，±20
±10，±20
3.5
3.5
3.5
3.5
3.5
3.5
3.5
3.5
2.5
2.5
2.5
2.5
2.5
2.5
200
200
200
200
200
200
200
200
150
150
150
150
120
120
1.6±0.20
1.6±0.20
1.6±0.20
1.6±0.20
1.6±0.20
1.6±0.20
1.6±0.20
1.6±0.20
1.6±0.20
1.6±0.20
1.6±0.20
1.6±0.20
1.6±0.20
1.6±0.20
R
R
R
R
R
R
R
R
R
R
R
R
R
R
0.15 μ
0.22 μ
0.33 μ
0.47 μ
1 μ
100
33000 p
47000 p
68000 p
0.1 μ
250
630
15000 p
22000 p
【Temperature Characteristic B7 : X7R】ꢀ1.15mm thickness（F）
Soldering
R:Reflow
W:Wave
Thickness*3
[mm]
HALT
Temperature
characteristics
Capacitance
[F]
Capacitance
tolerance [％]
tanδ
[％]
Part number 1
Part number 2
Rated voltage [V]
Rated voltage x ％
SMK316 B7102[]F-T
SMK316 B7152[]F-T
SMK316 B7222[]F-T
SMK316 B7332[]F-T
SMK316 B7472[]F-T
SMK316 B7682[]F-T
SMK316 B7103[]F-T
X7R
X7R
X7R
X7R
X7R
X7R
X7R
1000 p
1500 p
2200 p
3300 p
4700 p
6800 p
10000 p
±10，±20
±10，±20
±10，±20
±10，±20
±10，±20
±10，±20
±10，±20
2.5
2.5
2.5
2.5
2.5
2.5
2.5
120
120
120
120
120
120
120
1.15±0.10
1.15±0.10
1.15±0.10
1.15±0.10
1.15±0.10
1.15±0.10
1.15±0.10
R
R
R
R
R
R
R
630
●325TYPE
【Temperature Characteristic BJ : B/X5R】ꢀ2.5mm thickness（M）
Soldering
R:Reflow
W:Wave
R
Thickness*3
[mm]
HALT
Temperature
characteristics
Capacitance
[F]
Capacitance
tolerance [％]
tanδ
[％]
Part number 1
Part number 2
Rated voltage [V]
100
Rated voltage x ％
200
X5R*1
B
HMK325 BJ225[]M-T
2.2 μ
±10，±20
3.5
2.5±0.20
【Temperature Characteristic BJ : B/X5R】ꢀ1.9mm thickness（N）
Soldering
R:Reflow
W:Wave
Thickness*3
[mm]
HALT
Temperature
characteristics
Capacitance
[F]
Capacitance
tolerance [％]
tanδ
[％]
Part number 1
Part number 2
Rated voltage [V]
Rated voltage x ％
X5R*1
B
HMK325 BJ154[]N-T
HMK325 BJ224[]N-T
HMK325 BJ334[]N-T
HMK325 BJ474[]N-T
HMK325 BJ684[]N-T
HMK325 BJ105[]N-T
QMK325 BJ473[]N-T
QMK325 BJ104[]N-T
QMK325 BJ154[]N-T
QMK325 BJ224[]N-T
SMK325 BJ223[]N-T
SMK325 BJ333[]N-T
SMK325 BJ473[]N-T
0.15 μ
0.22 μ
0.33 μ
0.47 μ
0.68 μ
1 μ
±10，±20
±10，±20
±10，±20
±10，±20
±10，±20
±10，±20
±10，±20
±10，±20
±10，±20
±10，±20
±10，±20
±10，±20
±10，±20
3.5
3.5
3.5
3.5
3.5
3.5
2.5
2.5
2.5
2.5
2.5
2.5
2.5
200
200
200
200
200
200
150
150
150
150
120
120
120
1.9±0.20
1.9±0.20
1.9±0.20
1.9±0.20
1.9±0.20
1.9±0.20
1.9±0.20
1.9±0.20
1.9±0.20
1.9±0.20
1.9±0.20
1.9±0.20
1.9±0.20
R
R
R
R
R
R
R
R
R
R
R
R
R
X5R*1
B
X5R*1
B
100
X5R*1
B
X5R*1
B
X5R*1
B
X5R*1
B
47000 p
0.1 μ
X5R*1
B
250
630
X5R*1
B
0.15 μ
0.22 μ
22000 p
33000 p
47000 p
X5R*1
B
X5R*1
B
X5R*1
B
X5R*1
B
【Temperature Characteristic BJ : B/X5R】ꢀ1.15mm thickness（F）
Soldering
R:Reflow
W:Wave
R
Thickness*3
[mm]
HALT
Temperature
characteristics
Capacitance
[F]
Capacitance
tolerance [％]
tanδ
[％]
Part number 1
Part number 2
Rated voltage [V]
100
Rated voltage x ％
200
X5R*1
B
HMK325 BJ104[]F-T
0.1 μ
±10，±20
3.5
1.15±0.10
【Temperature Characteristic B7 : X7R】ꢀ2.5mm thickness（M）
Soldering
R:Reflow
W:Wave
R
Thickness*3
[mm]
Rated voltage [V]
HALT
Temperature
characteristics
Capacitance
[F]
Capacitance
tolerance [％]
tanδ
[％]
Part number 1
Part number 2
Rated voltage x ％
200
HMK325 B7225[]M-T
100
X7R
2.2 μ
±10，±20
3.5
2.5±0.20
【Temperature Characteristic B7 : X7R】ꢀ1.9mm thickness（N）
Soldering
R:Reflow
W:Wave
Thickness*3
[mm]
HALT
Temperature
characteristics
Capacitance
[F]
Capacitance
tolerance [％]
tanδ
[％]
Part number 1
Part number 2
Rated voltage [V]
Rated voltage x ％
HMK325 B7154[]N-T
HMK325 B7224[]N-T
HMK325 B7334[]N-T
HMK325 B7474[]N-T
HMK325 B7684[]N-T
HMK325 B7105[]N-T
QMK325 B7473[]N-T
QMK325 B7104[]N-T
QMK325 B7154[]N-T
QMK325 B7224[]N-T
X7R
X7R
X7R
X7R
X7R
X7R
X7R
X7R
X7R
X7R
0.15 μ
0.22 μ
0.33 μ
0.47 μ
0.68 μ
1 μ
±10，±20
±10，±20
±10，±20
±10，±20
±10，±20
±10，±20
±10，±20
±10，±20
±10，±20
±10，±20
3.5
3.5
3.5
3.5
3.5
3.5
2.5
2.5
2.5
2.5
200
200
200
200
200
200
150
150
150
150
1.9±0.20
1.9±0.20
1.9±0.20
1.9±0.20
1.9±0.20
1.9±0.20
1.9±0.20
1.9±0.20
1.9±0.20
1.9±0.20
R
R
R
R
R
R
R
R
R
R
100
47000 p
0.1 μ
250
0.15 μ
0.22 μ
▶ꢀThisꢀcatalogꢀcontainsꢀtheꢀtypicalꢀspecificationꢀonlyꢀdueꢀtoꢀtheꢀlimitationꢀofꢀspace.ꢀꢀWhenꢀyouꢀconsiderꢀtheꢀpurchaseꢀofꢀourꢀproducts,ꢀpleaseꢀcheckꢀourꢀspecification.ꢀ
Forꢀdetailsꢀofꢀeachꢀproductꢀ(characteristicsꢀgraph,ꢀreliabilityꢀinformation,ꢀprecautionsꢀforꢀuse,ꢀandꢀsoꢀon),ꢀseeꢀourꢀWebꢀsiteꢀ(http://www.ty-top.com/)ꢀ.ꢀ
ꢀ
23
■PARTS NUMBER
Part number 1
Soldering
R:Reflow
W:Wave
R
R
R
Thickness*3
[mm]
HALT
Temperature
characteristics
Capacitance
[F]
Capacitance
tolerance [％]
tanδ
[％]
Part number 2
Rated voltage [V]
630
Rated voltage x ％
SMK325 B7223[]N-T
SMK325 B7333[]N-T
SMK325 B7473[]N-T
X7R
X7R
X7R
22000 p
33000 p
47000 p
±10，±20
±10，±20
±10，±20
2.5
2.5
2.5
120
120
120
1.9±0.20
1.9±0.20
1.9±0.20
【Temperature Characteristic B7 : X7R】ꢀ1.15mm thickness（F）
Soldering
R:Reflow
W:Wave
R
Thickness*3
[mm]
HALT
Temperature
characteristics
Capacitance
[F]
Capacitance
tolerance [％]
tanδ
[％]
Part number 1
Part number 2
Rated voltage [V]
100
Rated voltage x ％
200
HMK325 B7104[]F-T
X7R
0.1 μ
±10，±20
3.5
1.15±0.10
●432TYPE
【Temperature Characteristic BJ : B/X5R】 2.5mm thickness（M）
Soldering
R:Reflow
W:Wave
Thickness*3
[mm]
HALT
Temperature
characteristics
Capacitance
[F]
Capacitance
tolerance [％]
tanδ
[％]
Part number 1
Part number 2
Rated voltage [V]
Rated voltage x ％
X5R*1
B
HMK432 BJ474[]M-T
HMK432 BJ105[]M-T
HMK432 BJ155[]M-T
HMK432 BJ225[]M-T
QMK432 BJ104[]M-T
QMK432 BJ224[]M-T
QMK432 BJ334[]M-T
QMK432 BJ474[]M-T
SMK432 BJ473[]M-T
SMK432 BJ683[]M-T
SMK432 BJ104[]M-T
0.47 μ
1 μ
±10，±20
±10，±20
±10，±20
±10，±20
±10，±20
±10，±20
±10，±20
±10，±20
±10，±20
±10，±20
±10，±20
3.5
3.5
3.5
3.5
2.5
2.5
2.5
2.5
2.5
2.5
2.5
200
200
200
200
150
150
150
150
120
120
120
2.5±0.20
2.5±0.20
2.5±0.20
2.5±0.20
2.5±0.20
2.5±0.20
2.5±0.20
2.5±0.20
2.5±0.20
2.5±0.20
2.5±0.20
R
R
R
R
R
R
R
R
R
R
R
X5R*1
B
100
X5R*1
B
1.5 μ
X5R*1
B
2.2 μ
X5R*1
B
0.1 μ
X5R*1
B
0.22 μ
0.33 μ
0.47 μ
47000 p
68000 p
0.1 μ
250
630
X5R*1
B
X5R*1
B
X5R*1
B
X5R*1
B
X5R*1
B
【Temperature Characteristic B7 : X7R】 2.5mm thickness（M）
Soldering
R:Reflow
W:Wave
Thickness*3
[mm]
HALT
Temperature
characteristics
Capacitance
[F]
Capacitance
tolerance [％]
tanδ
[％]
Part number 1
Part number 2
Rated voltage [V]
Rated voltage x ％
HMK432 B7474[]M-T
HMK432 B7105[]M-T
HMK432 B7155[]M-T
HMK432 B7225[]M-T
QMK432 B7104[]M-T
QMK432 B7224[]M-T
QMK432 B7334[]M-T
QMK432 B7474[]M-T
SMK432 B7473[]M-T
SMK432 B7683[]M-T
SMK432 B7104[]M-T
X7R
X7R
X7R
X7R
X7R
X7R
X7R
X7R
X7R
X7R
X7R
0.47 μ
1 μ
±10，±20
±10，±20
±10，±20
±10，±20
±10，±20
±10，±20
±10，±20
±10，±20
±10，±20
±10，±20
±10，±20
3.5
3.5
3.5
3.5
2.5
2.5
2.5
2.5
2.5
2.5
2.5
200
200
200
200
150
150
150
150
120
120
120
2.5±0.20
2.5±0.20
2.5±0.20
2.5±0.20
2.5±0.20
2.5±0.20
2.5±0.20
2.5±0.20
2.5±0.20
2.5±0.20
2.5±0.20
R
R
R
R
R
R
R
R
R
R
R
100
1.5 μ
2.2 μ
0.1 μ
0.22 μ
0.33 μ
0.47 μ
47000 p
68000 p
0.1 μ
250
630
LW Reversal �ecoupling Capacitor ꢁLW�CTM
●105TYPE
)
【Temperature Characteristic BJ : X5R】 0.3mm thickness（P）
Soldering
R:Reflow
W:Wave
Thickness*3
[mm]
HALT
Temperature
characteristics
Capacitance
[F]
Capacitance
tolerance [％]
tanδ
[％]
Part number 1
Part number 2
Rated voltage [V]
Rated voltage x ％
TWK105 BJ104MP-F
EWK105 BJ224MP-F
LWK105 BJ474MP-F
JWK105 BJ104MP-F
JWK105 BJ474MP-F
JWK105 BJ105MP-F
AWK105 BJ224MP-F
25
16
10
X5R
X5R
X5R
X5R*1
X5R*1
X5R
0.1 μ
0.22 μ
0.47 μ
0.1 μ
0.47 μ
1 μ
±20
±20
±20
±20
±20
±20
±20
5
150
150
150
150
150
150
150
0.3±0.05
0.3±0.05
0.3±0.05
0.3±0.05
0.3±0.05
0.3±0.05
0.3±0.05
R
R
R
R
R
R
R
10
10
5
6.3
4
10
10
10
X5R
0.22 μ
【Temperature Characteristic C6 : X6S , C7 : X7S】 0.3mm thickness（P）
Soldering
R:Reflow
W:Wave
Thickness*3
[mm]
HALT
Temperature
characteristics
Capacitance
[F]
Capacitance
tolerance [％]
tanδ
[％]
Part number 1
Part number 2
Rated voltage [V]
Rated voltage x ％
EWK105 C6104MP-F
LWK105 C7104MP-F
LWK105 C6224MP-F
JWK105 C7104MP-F
JWK105 C7224MP-F
JWK105 C6474MP-F
AWK105 C6224MP-F
AWK105 C6474MP-F
AWK105 C6105MP-F
16
10
X6S
X7S
X6S
X7S
X7S
X6S
X6S
X6S
X6S
0.1 μ
0.1 μ
0.22 μ
0.1 μ
0.22 μ
0.47 μ
0.22 μ
0.47 μ
1 μ
±20
±20
±20
±20
±20
±20
±20
±20
±20
5
150
150
150
150
150
150
150
150
150
0.3±0.05
0.3±0.05
0.3±0.05
0.3±0.05
0.3±0.05
0.3±0.05
0.3±0.05
0.3±0.05
0.3±0.05
R
R
R
R
R
R
R
R
R
5
10
5
6.3
4
10
10
10
10
10
●107TYPE
【Temperature Characteristic BJ : X5R】 0.5mm thickness（V）
Soldering
R:Reflow
W:Wave
Thickness*3
[mm]
HALT
Temperature
characteristics
Capacitance
[F]
Capacitance
tolerance [％]
tanδ
[％]
Part number 1
Part number 2
Rated voltage [V]
Rated voltage x ％
X5R*1
X5R*1
X5R*1
X5R
TWK107 BJ104MV-T
EWK107 BJ224MV-T
EWK107 BJ474MV-T
LWK107 BJ105MV-T
LWK107 BJ225MV-T
JWK107 BJ105MV-T
JWK107 BJ225MV-T
JWK107 BJ475MV-T
AWK107 BJ106MV-T
25
16
0.1 μ
0.22 μ
0.47 μ
1 μ
±20
±20
±20
±20
±20
±20
±20
±20
±20
5
150
150
150
150
150
150
150
150
150
0.5±0.05
0.5±0.05
0.5±0.05
0.5±0.05
0.5±0.05
0.5±0.05
0.5±0.05
0.5±0.05
0.5±0.05
R
R
R
R
R
R
R
R
R
5
5
10
10
10
10
10
10
10
X5R
2.2 μ
1 μ
X5R*1
X5R
6.3
4
2.2 μ
4.7 μ
10 μ
X5R
X5R
▶ꢀThisꢀcatalogꢀcontainsꢀtheꢀtypicalꢀspecificationꢀonlyꢀdueꢀtoꢀtheꢀlimitationꢀofꢀspace.ꢀꢀWhenꢀyouꢀconsiderꢀtheꢀpurchaseꢀofꢀourꢀproducts,ꢀpleaseꢀcheckꢀourꢀspecification.ꢀ
Forꢀdetailsꢀofꢀeachꢀproductꢀ(characteristicsꢀgraph,ꢀreliabilityꢀinformation,ꢀprecautionsꢀforꢀuse,ꢀandꢀsoꢀon),ꢀseeꢀourꢀWebꢀsiteꢀ(http://www.ty-top.com/)ꢀ.ꢀ
ꢀ
24
Multilayer Ceramic Capacitors
■PACKAGING
①Minimum Quantity
●Taped package
Thickness
Standard quantity [pcs]
Type(EIA)
mm
0.2
code
C, D
P, T
P
Paper tape
Embossed tape
40000
□MK042(01005)
□MK063(0201)
－
0.3
15000
10000
20000
15000
□WK105(0204) ※
0.3
0.2
C
□MK105(0402)
0.3
P
－
0.5
V
10000
□VK105(0402) ※
□MK107(0603)
0.5
W
K
0.45
0.5
4000
－
□WK107(0306) ※
□MR107(0603)
V
4000
－
0.8
A
0.45
0.85
1.25
0.85
1.15
1.25
1.6
K
4000
□MK212(0805)
□WK212(0508)
□MR212(0805)
※
D
G
－
3000
－
D
4000
F
□MK316(1206)
□MR316(1206)
3000
G
－
L
0.85
1.15
1.9
D
F
2000
□MK325(1210)
□MR325(1210)
N
－
－
2.0max.
2.5
Y
M
M
500（T）, 1000（P）
500
□MK432(1812)
2.5
Note : ※ LW Reverse type.
②Taping material
※No bottom tape for pressed carrier tape
●Card board carrier tape
●Embossed tape
Chip filled
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
c_mlcc_pack_e-01
③Representative taping dimensions
●Paper Tape（8mm wide）
●Pressed carrier tape（ 2mm pitch）
Chip Cavity
Insertion Pitch
Ｆ
Tape Thicknes
Type(EIA)
Ａ
Ｂ
Ｔ
T1
□MK063(0201)
0.37
0.67
0.45max.
0.42max.
□WK105(0204) ※
□MK105(0402) （*1 C）
□MK105(0402) （*1 P）
2.0±0.05
0.65
1.15
0.4max.
0.3max.
0.42max.
Unit：mm
0.45max.
Note *1 Thickness, C：0.2mm ,P：0.3mm. ※ LW Reverse type.
●Punched carrier tape （2mm pitch）
Chip Cavity
Type(EIA)
Insertion Pitch
Ｆ
Tape Thickness
Ｔ
Ａ
Ｂ
□MK105 (0402)
□VK105 (0402)
0.65
1.15
2.0±0.05
0.8max.
Unit：ｍｍ
●Punched carrier tape （4mm pitch）
Chip Cavity
Insertion Pich
Ｆ
Tape Thickness
Ｔ
Type(EIA)
Ａ
Ｂ
□MK107(0603)
□WK107(0306)
□MR107(0603)
□MK212(0805)
□WK212(0508)
□MK316(1206)
※
※
1.0
1.8
1.1max.
4.0±0.1
1.65
2.0
2.4
3.6
1.1max.
Note：Taping size might be different depending on the size of the product. ※ LW Reverse type.
Unit：mm
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
c_mlcc_pack_e-01
●Embossed tape（4mm wide）
Chp Cavity
Insertion Pitch
Ｆ
Tape Thickness
Type(EIA)
Ａ
Ｂ
K
T
□MK042(01005)
0.23
0.43
1.0±0.02
0.5max.
0.25max.
Unit：mm
●Embossed tape（8mm wide）
Chip Cavity
Insertion Pitch
Ｆ
Tape Thickness
Type(EIA)
Ａ
Ｂ
K
T
□WK107(0306) ※
□MK212(0805)
1.0
1.8
1.3max.
0.25±0.1
1.65
2.0
2.4
3.6
□MR212(0805)
4.0±0.1
□MK316(1206)
3.4max.
0.6max.
□MR316(1206)
□MK325(1210)
2.8
3.6
□MR325(1210)
Note： ※ LW Reverse type.
Unit：mm
●Embossed tape（12mm wide）
Chip Cavity
Insertion Pitch
Tape Thickness
Type(EIA)
Ａ
Ｂ
Ｆ
K
T
□MK432(1812)
3.7
4.9
8.0±0.1
4.0max.
0.6max.
Unit：mm
④Trailer and Leader
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
c_mlcc_pack_e-01
⑤Reel size
A
B
C
D
E
R
φ178±2.0
φ50min.
φ13.0±0.2
φ21.0±0.8
2.0±0.5
1.0
T
W
4mm wide tape
8mm wide tape
12mm wide tape
1.5max.
2.5max.
2.5max.
5±1.0
10±1.5
14±1.5
Unit：mm
⑥Top Tape Strength
The top tape requires a peel-off force of 0.1 to 0.7N in the direction of the arrow as illustrated below.
⑦Bulk Cassette
The exchange of individual specification is necessary.
Please contact Taiyo Yuden sales channels.
Unit：mm
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
c_mlcc_pack_e-01
Multilayer Ceramic Capacitors , Super Low Distortion Multilayer Ceramic Capacitors and
High Reliability Application Multilayer Ceramic Capacitors are noted separately.
Medium-High Voltage Multilayer Ceramic Capacitor
■RELIABILITY DATA
1. Operating Temperature Range
X7R, X7S : －55 to ＋125℃
Specified Value
X5
B
: －55 to ＋85℃
: －25 to ＋85℃
2. Storage Temperature Range
X7R, X7S : －55 to ＋125℃
Specified Value
X5R
B
: －55 to ＋85℃
: －25 to ＋85℃
3. Rated Voltage
Specified Value
100VDC(HMK), 250VDC(QMK), 630VDC(SMK)
4. Withstanding Voltage（Between terminals）
Specified Value
No breakdown or damage
Applied voltage
Duration
: Rated voltage×2.5（HMK）, Rated voltage×2（QMK）, Rated voltage×1.2（SMK）
Test Methods and
Remarks
: 1 to 5sec.
: 50mA max.
Carge/discharge current
５．Insulation Resistance
Specified Value
100MΩμF or 10GΩ, whichever is smaller.
Applied voltage
Duration
: Rated voltage（HMK, QMK）, 500V（SMK）
Test Methods and
Remarks
: 60±5sec.
: 50mA max.
Charge/discharge current
6．Capacitance （Tolerance）
Specified Value
±10%, ±20%
Masuring frequency
Measuring voltage
Bias application
: 1kz±10%
: 1±0.2Vrms
: None
Test Methods and
Remarks
７．Dissipation Factor
Specified Value
3.5%max（HMK）
2.5%max（QMK, SMK）
Measuring frequency
Measuring voltage
Bas application
: 1kHz±10%
: 1±0.2Vrms
: None
Test Methods and
Remarks
8．Temperature Characteristic of Capacitance
B
: ±10%（－25 to ＋85℃）
: ±15%（－55 to ＋85℃）
X5R
X7R
X7S
Specified Value
: ±15%（－55 to ＋125℃）
: ±22%（－55 to ＋125℃）
Capacitance value at each step shall be measured in thermal equilibrium, and the temperature characteristic shall be calculated from the
following equation.
Step
B
X5R、X7R、X7S
Minimum operating tempeature
20℃ 25℃
1
2
3
Test Methods and
Remarks
Maximum operating temperature
（C－C2）
C2
×100（%）
C
: Capacitance value in Step 1 or Step 3
C2 : Capacitance value in Step 2
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
c_mlcc_mhv_reli_e-01
9．Deflection
Appearance
: No abnormality
: Within±10%
Specified Value
Capacitance change
Warp
: 1mm
: 10sec.
Duration
Test board
Thicknss
: Glass epoxy-resin substrate
: 1.6mm
Test Methods and
Remarks
Capacitance measurement shall be conducted with the board bent.
10．Adhesive Strength of Terminal Electrodes
Specified Value
No terminal separation or its indication.
Applied force
Duration
: 5N
: 30±5sec.
Test Methods and
Remarks
11．Solderability
Specified Value
At least 95% of terminal electrode is covered by new solder
Eutectic solder
Lead-free solder
Sn-3.0Ag-0.5Cu
245±3℃
Solder type
H60A or H63A
230±5℃
Test Methods and
Remarks
Solder temperature
Duration
4±1 sec.
12．Resistance to Soldering
Appearance
: No abnormality
Capacitance change
Dissipation factor
: Within±15%（HMK）, ±10%（QMK, SMK）
: Inital value
Specified Value
Insulation resistance
Withstanding voltage
: Initial value
（between terminals） : No abnormality
Preconditioning
: Thermal treatment（at 150℃ for 1hr） Note1
: 270±5℃
Solder temperature
Test Methods and Duration
Remarks Prehating conditions
: 3±0.5sec.
: 80 to 100℃, 2 to 5 min.
150 to 200℃, 2 to 5min.
Recovery
: 24±2hrs under the stadard condition Note3
13．Temperature Cycle （Thermal Shock）
Appearance
: No abnormality
Capacitance change
Specified Value
: Within±15%（HMK）, ±7.5%（QMK, SMK）
: Initial value
Dissipation factor
Insulation resistance
: Initial value
Preconditioning : Thermal treatment （at 150℃ for 1hr） Note1
Conditions for 1 cycle
Step
temperature（℃）
Minimum operating temperature
Normal temperature
Time（min.）
30±3min.
2 to 3min.
30±3min.
2 to 3min.
1
2
3
4
Test Methods and
Remarks
Maximum operating temperature
Normal temperature
Number of cycles : 5 times
Recovery : 24±2hrs under the standard condition Note3
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
c_mlcc_mhv_reli_e-01
14．Humidity （Steady state）
Appearance
: No abnormality
Capacitance change
Dissipation factor
: Within±15%
Specified Value
: 7%max（HMK）, 5%max（QMK, SMK）.
: 25MΩμF or 1000MΩ, whichever is smaller.
Insulation resistance
Preconditioning
Temperature
Humidity
: Thermal treatment（at 150℃ for 1hr） Note1
: 40±2℃
Test Methods and
Remarks
: 90 to 95%RH
: 500 ＋24/－0 hrs
Duration
Recovery
: 24±2hrs under the standard condition Note3
15．Humidity Loading
Specified Value
Appearance
: No abnormality
Capacitance change
Dissipation factor
Insulation resistance
: Within±15%
: 7%max（HMK）, 5%max（QMK, SMK）.
: 10MΩμF or 500MΩ, whichever is smaller.
According to JIS 5102 clause 9.9.
Preconditioning
Temperature
: Voltage treatment Note2
: 40±2℃
Test Methods and Humidity
Remarks Applied voltage
: 90 to 95%RH
: Rated voltage
Charge/discharge current
Duration
: 50mA max.
: 500 ＋24/－0 hrs
: 24±2hrs under the standard condition Note3
Recovery
16．High Temperature Loading
Appearance
: No abnormality
Capacitance change
: Within±15%
Specified Value
Dissipation factor
: 7%max（HMK）, 5%max（QMK, SMK）.
: 50MΩμF or 1000MΩ, whichever is smaller.
Insulation resistance
According to JIS 5102 clause 9.10.
Preconditioning
Temperature
: Voltage treatment Note2
: Maximum operating temperature
: Rated voltage×2（HMK）
Rated voltage×1.5（QMK）
Rated voltage×1.2（SMK）
: 50mA max.
Applied voltage
Test Methods and
Remarks
Charge/discharge current
Duration
: 1000 ＋24/－0 hrs
Recovery
: 24±2hrs under the standard condition Note3
Note1 Thermal treatment : Initial value shall be measured after test sample is heat-treated at 150＋0/－10℃ for an hour and kept at
24±2hours.
room temperature for
Note2 Voltage treatment : Initial value shall be measured after test sample is voltage-treated for an hour at both the temperature and voltage specified in the
test conditions, and kept at room temperature for 24±2hours.
Note3 Standard condition : Temperature: 5 to 35℃, Relative humidity: 45 to 85 % RH, Air pressure: 86 to 106kPa
When there are questions concerning measurement results, in order to provide correlation data, the test shall be conducted
under the following condition.
Temperature: 20±2℃, Relative humidity: 60 to 70 % RH, Air pressure: 86 to 106kPa
Unless otherwise specified, all the tests are conducted under the "standard condition".
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
c_mlcc_mhv_reli_e-01
High Reliability Application Multilayer Ceramic Capacitors are noted separately.
Precautions on the use of Multilayer Ceramic Capacitors
■PRECAUTIONS
1. Circuit Design
◆Verification of operating environment, electrical rating and performance
1. A malfunction of equipment in fields such as medical, aerospace, nuclear control, etc. may cause serious harm to human life or have
severe social ramifications.
Therefore, any capacitors to be used in such equipment may require higher safety and reliability, and shall be clearly differentiated from
them used in general purpose applications.
Precautions
◆Operating Voltage （Verification of Rated voltage）
1. The operating voltage for capacitors must always be their rated voltage or less.
If an AC voltage is loaded on a DC voltage, the sum of the two peak voltages shall be the rated voltage or less.
For a circuit where an AC or a pulse voltage may be used, the sum of their peak voltages shall also be the rated voltage or less.
2. Even if an applied voltage is the rated voltage or less reliability of capacitors may be deteriorated in case that either a high frequency AC
voltage or a pulse voltage having rapid rise time is used in a circuit.
2. PCB Design
◆Pattern configurations （Design of Land-patterns）
1. When capacitors are mounted on PCBs, the amount of solder used （size of fillet） can directly affect the capacitor performance.
Therefore, the following items must be carefully considered in the design of land patterns:
（1）Excessive solder applied can cause mechanical stresses which lead to chip breaking or cracking. Therefore, please consider
appropriate land-patterns for proper amount of solder.
Precautions
（2）When more than one component are jointly soldered onto the same land, each component's soldering point shall be separated by
solder-resist.
◆Pattern configurations （Capacitor layout on PCBs）
After capacitors are mounted on boards, they can be subjected to mechanical stresses in subsequent manufacturing processes （PCB
cutting, board inspection, mounting of additional parts, assembly into the chassis, wave soldering of the boards, etc.）. For this reason, land
pattern configurations and positions of capacitors shall be carefully considered to minimize stresses.
◆Pattern configurations （Design of Land-patterns）
The following diagrams and tables show some examples of recommended land patterns to prevent excessive solder amounts.
（1）Recommended land dimensions for typical chip capacitors
●Multilayer Ceramic Capacitors : Recommended land dimensions
Land patterns for PCBs
（unit: mm）
Wave-soldering
Type
107
1.6
212
2.0
316
3.2
325
3.2
L
Size
W
0.8
1.25
1.6
2.5
A
B
C
0.8 to 1.0
0.5 to 0.8
0.6 to 0.8
1.0 to 1.4
0.8 to 1.5
0.9 to 1.2
1.8 to 2.5
0.8 to 1.7
1.2 to 1.6
1.8 to 2.5
0.8 to 1.7
1.8 to 2.5
Reflow-soldering
Type 042
063
0.6
105
1.0
107
1.6
0.8
212
2.0
316
3.2
325
3.2
432
Technical
L
0.4
4.5
Size
considerations
W
0.2
0.3
0.5
1.25
1.6
2.5
3.2
A
B
C
0.15 to 0.25
0.15 to 0.20
0.15 to 0.30
0.20 to 0.30
0.20 to 0.30
0.25 to 0.40
0.45 to 0.55
0.40 to 0.50
0.45 to 0.55
0.8 to 1.0
0.8 to 1.2
0.8 to 1.2
0.9 to 1.6
1.8 to 2.5
1.0 to 1.5
1.2 to 2.0
1.8 to 2.5
1.0 to 1.5
1.8 to 3.2
2.5 to 3.5
1.5 to 1.8
2.3 to 3.5
0.6 to 0.8
0.6 to 0.8
Note：Recommended land size might be different according to the allowance of the size of the product.
●LWDC: Recommended land dimensions for reflow-soldering
（unit: mm）
Type
105
0.52
107
0.8
212
1.25
L
Size
W
1.0
1.6
2.0
A
B
C
0.18 to 0.22
0.2 to 0.25
0.9 to 1.1
0.25 to 0.3
0.3 to 0.4
1.5 to 1.7
0.5 to 0.7
0.4 to 0.5
1.9 to 2.1
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
c_mlcc_prec_e-01
（2）Examples of good and bad solder application
Items
Not eommended
Recommended
Mixed mounting of SMD and
leaded components
Component placement close to
the chassis
Hand-soldering of leaded
Components near mounted
components
Horizontal component
placement
◆Pattern configurations （Capacitor layout on PCBs）
1-1. The following is examples of good and bad capacitor layouts ; capacitors shall be located to minimize any
stresses from board warp or deflection.
possible mechanical
Items
Not recommended
Recommended
Place the product at a right
angle to the direction of the
anticipated mechanical
stress.
Deflection of board
1-2. The amount of mechanical stresses given will vary depending on capacitor layout. Please refer to diagram below.
1-3. When PCB is split, the amount of mechanical stress on the capacitors can vary according to the method used. The following methods
are listed in order from least stressful to most stressful: push-back, slit, V-grooving, and perforation. Thus, please consider the PCB,
split methods as well as chip location.
3. Mounting
Precautions
◆Adjustment of mounting machine
1. When capacitors are mounted on PCB, excessive impact load shall not be imposed on them.
2. Maintenance and inspection of mounting machines shall be conducted periodically.
◆Selection of Adhesives
1. When chips are attached on PCBs with adhesives prior to soldering, it may cause capacitor characteristics degradation unless the
following factors are appropriately checked : size of land patterns, type of adhesive, amount applied, hardening temperature and
hardening period. Therefore, please contact us for further information.
◆Adjustment of mounting machine
1. When the bottom dead center of a pick-up nozzle is too low, excessive force is imposed on capacitors and causes damages. To avoid
this, the following points shall be considerable.
Technical
（1）The bottom dead center of the pick-up nozzle shall be adjusted to the surface level of PCB without the board deflection.
（2）The pressure of nozzle shall be adjusted between 1 and 3 N static loads.
considerations
（3）To reduce the amount of deflection of the board caused by impact of the pick-up nozzle, supporting pins or back-up pins shall be
used on the other side of the PCB. The following diagrams show some typical examples of good and bad pick-up nozzle
placement:
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
c_mlcc_prec_e-01
Items
Not recommended
Recommended
Single-sided mounting
Double-sided mounting
2. As the alignment pin is worn out, adjustment of the nozzle height can cause chipping or cracking of capacitors because of mechanical
impact on the capacitors.
To avoid this, the monitoring of the width between the alignment pins in the stopped position, maintenance, check and replacement of
the pin shall be conducted periodically.
◆Selection of Adhesives
Some adhesives may cause IR deterioration. The different shrinkage percentage of between the adhesive and the capacitors may result in
stresses on the capacitors and lead to cracking. Moreover, too little or too much adhesive applied to the board may adversely affect
components. Therefore, the following precautions shall be noted in the application of adhesives.
（1）Required adhesive characteristics
a. The adhesive shall be strong enough to hold parts on the board during the mounting & solder process.
b. The adhesive shall have sufficient strength at high temperatures.
c. The adhesive shall have good coating and thickness consistency.
d. The adhesive shall be used during its prescribed shelf life.
e. The adhesive shall harden rapidly.
f. The adhesive shall have corrosion resistance.
g. The adhesive shall have excellent insulation characteristics.
h. The adhesive shall have no emission of toxic gasses and no effect on the human body.
（2）The recommended amount of adhesives is as follows;
［Recommended condition］
Amount adhesive
After capacitors are bonded
Figure
212/316 case sizes as examples
a
b
c
0.3mm min
100 to 120μm
Adhesives shall not contact land
4. Soldering
◆Selection of Flux
Since flux may have a significant effect on the performance of capacitors, it is necessary to verify the following conditions prior to use;
（1）Flux used shall be less than or equal to 0.1 wt%（ in Cl equivalent） of halogenated content. Flux having a strong acidity content shall
not be applied.
（2）When shall capacitors are soldered on boards, the amount of flux applied shall be controlled at the optimum level.
（3）When water-soluble flux is used, special care shall be taken to properly clean the boards.
Precautions
◆Soldering
Temperature, time, amount of solder, etc. shall be set in accordance with their recommended conditions.
Sn-Zn solder paste can adversely affect MLCC reliability.
Please contact us prior to usage of Sn-Zn solder.
◆Selection of Flux
1-1. When too much halogenated substance（Chlorine, etc.） content is used to activate flux, or highly acidic flux is used, it may lead to
corrosion of terminal electrodes or degradation of insulation resistance on the surfaces of the capacitors.
1-2. Flux is used to increase solderability in wave soldering. However if too much flux is applied, a large amount of flux gas may be emitted
and may adversely affect the solderability. To minimize the amount of flux applied, it is recommended to use a flux-bubbling system.
1-3. Since the residue of water-soluble flux is easily dissolved in moisture in the air, the residues on the surfaces of capacitors in high
humidity conditions may cause a degradation of insulation resistance and reliability of the capacitors. Therefore, the cleaning
methods and the capability of the machines used shall also be considered carefully when water-soluble flux is used.
Technical
considerations
◆Soldering
･ Ceramic chip capacitors are susceptible to thermal shock when exposed to rapid or concentrated heating or rapid cooling.
･ Therefore, the soldering must be conducted with great care so as to prevent malfunction of the components due to excessive thermal
shock.
･ Preheating : Capacitors shall be preheated sufficiently, and the temperature difference between the capacitors and solder shall be within
100 to 130℃.
･ Cooling : The temperature difference between the capacitors and cleaning process shall not be greater than 100℃.
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
c_mlcc_prec_e-01
［Reflow soldering］
【Recommended conditions for eutectic
soldering】
【Recommended condition for Pb-free
soldering】
Caution
①The ideal condition is to have solder mass（fillet）controlled to 1/2 to 1/3 of the
thickness of a capacitor.
②Because excessive dwell times can adversely affect solderability, soldering duration shall
be kept as close to recommended times as possible.
［Wave soldering］
【Recommended conditions for eutectic
soldering】
【Recommended condition for Pb-free
soldering】
Caution
①Wave soldering must not be applied to capacitors designated as for reflow soldering only.
［Hand soldering］
【Recommended conditions for eutectic
soldering】
【Recommended condition for Pb-free
soldering】
⊿T
⊿T
325type or more
⊿T≦130℃
316type or less
⊿T≦150℃
Caution
①Use a 50W soldering iron with a maximum tip diameter of 1.0 mm.
②The soldering iron shall not directly touch capacitors.
5. Cleaning
Precautions
◆Cleaning conditions
1. When PCBs are cleaned after capacitors mounting, please select the appropriate cleaning solution in accordance with the intended use
of the cleaning. （e.g. to remove soldering flux or other materials from the production process.）
2. Cleaning condition shall be determined after it is verified by using actual cleaning machine that the cleaning process does not affect
capacitor's characteristics.
1. The use of inappropriate cleaning solutions can cause foreign substances such as flux residue to adhere to capacitors or deteriorate
their outer coating, resulting in a degradation of the capacitor's electrical properties （especially insulation resistance）.
2. Inappropriate cleaning conditions（ insufficient or excessive cleaning） may adversely affect the performance of
In the case of ultrasonic cleaning, too much power output can cause excessive vibration of PCBs which may lead
the capacitors.
to the
Technical
cracking of capacitors or the soldered portion, or decrease the terminal electrodes' strength. Therefore, the following conditions shall
be carefully checked;
considerations
Ultrasonic output :
20 W/ℓ or less
40 kHz or less
Ultrasonic frequency :
Ultrasonic washing period : 5 min. or less
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
c_mlcc_prec_e-01
6. Resin coating and mold
1. With some type of resins, decomposition gas or chemical reaction vapor may remain inside the resin during the
while left under normal storage conditions resulting in the deterioration of the capacitor's performance.
hardening period or
Precautions
2. When a resin's hardening temperature is higher than capacitor's operating temperature, the stresses generated by the excessive heat
may lead to damage or destruction of capacitors.
The use of such resins, molding materials etc. is not recommended.
7. Handling
◆Splitting of PCB
1. When PCBs are split after components mounting, care shall be taken so as not to give any stresses of deflection or twisting to the board.
2. Board separation shall not be done manually, but by using the appropriate devices.
Precautions
◆Mechanical considerations
Be careful not to subject capacitors to excessive mechanical shocks.
（1）If ceramic capacitors are dropped onto a floor or a hard surface, they shall not be used.
（2）Please be careful that the mounted components do not come in contact with or bump against other boards or
components.
8. Storage conditions
◆Storage
1. To maintain the solderability of terminal electrodes and to keep packaging materials in good condition, care must be taken to control
temperature and humidity in the storage area. Humidity should especially be kept as low as possible.
・Recommended conditions
Ambient temperature : Below 30℃
Humidity
: Below 70% RH
Precautions
The ambient temperature must be kept below 40℃. Even under ideal storage conditions, solderability of capacitor is deteriorated as
time passes, so capacitors shall be used within 6 months from the time of delivery.
・Ceramic chip capacitors shall be kept where no chlorine or sulfur exists in the air.
2. The capacitance values of high dielectric constant capacitors will gradually decrease with the passage of time, so
care shall be
taken to design circuits . Even if capacitance value decreases as time passes, it will get back to the initial value by a heat treatment at
150℃ for 1hour.
If capacitors are stored in a high temperature and humidity environment, it might rapidly cause poor solderability due to terminal oxidation and
quality loss of taping/packaging materials. For this reason, capacitors shall be used within 6 months from the time of delivery. If exceeding the
above period, please check solderability before using the capacitors.
Technical
considerations
※RCR-2335B（Safety Application Guide for fixed ceramic capacitors for use in electronic equipment）is published by JEITA.
Please check the guide regarding precautions for deflection test, soldering by spot heat, and so on.
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
c_mlcc_prec_e-01
相关型号：
HMK107B7223MA8T
Medium-High Voltage MLCC for Telecommunications Infrastructure and Industrial Equipment / Medical Devices
TAIYO YUDEN
HMK107B7332KA-T
Capacitor, Ceramic, Chip, General Purpose, 3300pF, 100V, ±10%, X7R, 0603 (1608 mm), 0.031"T, -55º ~ +125ºC, 7" Reel/4mm pitch
TAIYO YUDEN
HMK107B7332KA8T
Medium-High Voltage MLCC for Telecommunications Infrastructure and Industrial Equipment / Medical Devices
TAIYO YUDEN
HMK107B7332KAHT
Capacitor, Ceramic, Chip, General Purpose, 3300pF, 100V, ±10%, X7R, 0603 (1608 mm), 0.031"T, -55º ~ +125ºC, 7" Reel/4mm pitch
TAIYO YUDEN
HMK107B7332MA
Ceramic Capacitor, Multilayer, Ceramic, 100V, 20% +Tol, 20% -Tol, X7R, -/+15ppm/Cel TC, 0.0033uF, 0603,
TAIYO YUDEN
HMK107B7332MA8T
Medium-High Voltage MLCC for Telecommunications Infrastructure and Industrial Equipment / Medical Devices
TAIYO YUDEN
HMK107B7333KA-T
Capacitor, Ceramic, Chip, General Purpose, 0.033uF, 100V, ±10%, X7R, 0603 (1608 mm), 0.031"T, -55º ~ +125ºC, 7" Reel/4mm pitch
TAIYO YUDEN
HMK107B7333KA8T
Medium-High Voltage MLCC for Telecommunications Infrastructure and Industrial Equipment / Medical Devices
TAIYO YUDEN
©2020 ICPDF网 联系我们和版权申明